With dramatic improvement of accuracy & repeatability by S/W & H/W renovation, the MS-11 can precisely measure and
inspect solder paste on Mini-LED chips as small as 0201mm, with a designated height of 30㎛.

MIRTEC has implemented a next-generation vision system featuring 4㎛/6㎛ high-resolution lenses for greater precision and stability in inspection.
Additionally, the CoaXPress interface enables high-speed inspection, while the 25M high-resolution camera provides a large field of view (FOV)
for enhanced performance.

With a large field of view (FOV), a larger and clearer image can be captured in a single shot, reducing the number of images required.
This enables faster and more accurate inspections.

Many 3D SPI systems on the market use conventional lenses, which cause image distortion.
MIRTEC doesn't.

All of our 3D SPI systems are equipped with telecentric lenses, eliminating image errors caused by perspective distortion
and ensuring highly precise 3D inspections.

The MS-11 SPI machine detects and automatically compensates for PCB warpage up to 士5mm within its field of view (FOV) using the Z-axis, while capturing the board images.
This ensures accurate inspection and guarantees precise 3D measurement results even for bent PCBs regardless of their warpage condition.

MIRTEC's SSF (Solder Supplying Function) automatically supplies solder onto insufficient or missing pads using a solder dispenser integrated into the optical system after inspection